In a moment we’ll see why that is not the case. Often the use of a higher soldering temperature is listed as a good thing, as it supposedly shortens the soldering time per pad and with it the heating of the component, while also producing a better joint. Here the argument essentially concerns what constitutes a good solder joint. The third and last problem is by far the most common thing which people argue about. The second is mostly related to the (plastic) packaging of components as they absorb moisture and the issues this can cause. The first one is fairly obvious: copper oxidizes, which means that solder will not make a good connection. The problems that affect the soldering of components – whether it involves soldering by hand or reflow/wave-soldering – essentially come down to oxidation, moisture ingress and temperature cycling.
Can we say something scientific about soldering?
MINIATURE ALLIGATOR CLIPT TRIAL
From organic chemistry with rosin, to the material properties of fragile gold bond wires and silicon dies inside IC packages and the effects of thermal stress on the different parts of an IC package, it’s a complicated topic that deserves a lot more attention than it usually gets.Ī casual inquiry around one’s friends, acquaintances, colleagues and perfect strangers on the internet usually reveals the same pattern: people have picked up a soldering iron at some point, and either figured out what seemed to work through trial and error, or learned from someone else who has learned what seemed to work through trial and error. Often it feels as if soldering is deemed to be more of an art form than something that’s underpinned by the cold, hard reality of physics and chemistry.
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